Produce a clean polished cross section of almost any material at 90 degrees to the sample surface--ideal for measurement of multilayered structures.  Useful for difficult-to-polish soft materials (Cu, Al, Au, solder, polymers) as well as difficult-to-cut hard materials (ceramic, glass, Si) and composites.  Maximum area polished is about 700µm wide X 250µm high, depending on material.